West System Microspheres 4 L


Fillers help expand epoxy's versatility by altering its consistency for specific applications. Each filler possesses a unique set of physical characteristics, but they can be generally categorised as either Adhesive (high density) or Fairing (low density).

Adhesive filler mixtures cure to a strong, hard-to-sand plastic suitable for structural applications like bonding, filleting and hardware bonding. Fairing filler mixtures cure to a light, easily sandable material that is generally used for cosmetic or surface applications like shaping, filling and fairing.

411 Microsphere Blend is a low density filler which cures to a lightweight filling putty with excellent filleting characteristics. 411 Microsphere Blend is also used as a low density adhesive for edge gluing in strip plank construction.


Style Code  411B



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